For low profile/small package
Power semiconductors follow the trend of product miniaturization in the industrial equipment industry (inverters, servos, etc.). Therefore, we are working on the development of low profile and small package.
We offer a wide range of converter modules matching the height of the main circuit control elements (IGBT/IPM). The heatsink can then be shared, as a result the customer’s mounting process is shortened.
In addition, we offer an extended lineup of SIP/DIP modules and large capacity modules with a height of 17 to 22 mm.
Example: Industrial robots, commercial air conditioners, elevators, welders, inverters