Introduction of Okayama Plant
Okayama Plant
In operation since 1985.
Okayama Plant is located in Nagi, Okayama Prefecture, surrounded by a rich environment, and performs a complete process from manufacturing wafers and chips, which are the core of power semiconductor devices, to post-process assembly and inspection. We produce a wide range of discrete and module products.
Okayama Plant Products
We also manufacture products using SiC, which is expected to become a key device for energy saving in high current and high voltage applications due to its lower loss and faster speed operation than conventional Si.
-
Wafer
-
Power Module
-
Discrete
Manufacturing Process
Our Plant produces power modules and discrete products that are used in a wide range of applications from White home appliances to commercial air conditioners, photovoltaics and bullet trains.
We operate an integrated production system from the pre-process (wafer) to the post-process (assembly and inspection).
Diffusion process
Photolithography process
Glass passivasion process
Metal deposition process
Chip process
Base soldering process
Molding proces
Inspection process
