Wafers / Chips
· Product Group
· Product Facilities
· Wafer Factory Facilities
Discrete
· Discrete Semiconductor Range
· Discrete Semiconductor Features
· Applications for Discrete Semiconductors
Power Module
· Diode Modules
· Thyristor, Triac Modules
· Diode for high frequency inverters
· The Current-Surge Protection 500A Thyristor Module
· Low height / Compact Design
IPM
· Intelligent Power Module (IPM)
· Product samples using standard IPMs
Future Oriented
· Core Power Device Principles
· New Material Device Technology
· Highly Efficient Device Technology
· Multi-Functional Device Technology
Introduction of our Wafer Factory Facilities
We have adopted the down flow design in our 5-inch clean Room.
Clean room
All working areas in our clean room have adopted a down flow design. This allows wind to flow down from ceiling to floor.
Photo Engraving Room
Stepper
Diffusion Furnace
Our diffusion furnace adopts soft landing method and a structure that generates fewer particles during boat loading.
Copyright (C) 2004 Sansha Electric Manufacuring Co.,Ltd.All Rights Reserved
Introduction of our Wafer Factory Facilities
