Sansha Manufacturing - Top Page
HOMEQ&ASite PolicySite MapTo Japanese SiteTo Chinese Page
TechnologyProductApplication ExampleIRCompanyContact
Semiconductors
Wafers / Chips
Discrete
Power Module
IPM
Future Oriented
Power Supply (by Fields)
Power Supply (by Items)
Evaluation & Transition
Procurement
Maintenance



Discrete Semiconductor Lineup
TO-220F
TO-220F
TO-92
TO-92
TO-220
TO-220
TO-251
TO-251
TO-252
TO-252
Most of the small capacity mold packages we’ve sold have been of the TO-220F type package Triac. We are trying to expand our range of small mold packages as part of our efforts in expanding our wafer/chip business. This will include newer packaging and also focusing on smaller capacity models to be used in the home appliance market.

Outline

1) We are planning to expand our product range from three types of discrete semiconductor packages to 8.

The current package includes models TO-220/TO-220 F/TO -92, but we are planning to add SOT-89/TO-251/TO-252/TO-263/TO-3P, to give us a total range of eight models in the package.

2) We can offer a quick response to sample requests by using in-house molders.

Transfer mold technology is the basic technology for small packages in our factory. We can respond quickly to sample requests from our customers by using this technology.

3) We are expanding our product range.

In addition to the usual Thyristor and Triac, we have included a power Transistor, a "Schottky" Diode, and a high-speed Diode, in order to round out our family of power semiconductors.

Wafer Foundry & Chip Product Range
Wafer Foundry & Chip Product Range

?Top
Copyright (C) 2004 Sansha Electric Manufacuring Co.,Ltd.All Rights Reserved